The Lintek Difference

Lintek has established a strong presence in the microwave and high frequency market by producing boards with highly accurate features and excellent impedance characteristics.

Patented technology

Lintek’s patented High Vacuum Deposition process has been developed and refined since 1986, moving through three generations of metaliser technology.

Our process vaporises high purity copper onto the surface and through the holes of various substrates by using a conveyor system to pass individual panels into and out of the vapor deposition chamber. The panel is then rotated to coat the second side before returning to the conveyor to move onto the next process step.

metaliserwhite

Unrivalled accuracy

Lintek’s superior quality comes from our unique manufacturing metaliser process.
By vacuum depositing a 2 microns seed layer on bare panels instead of starting with 18 microns foil, the final panel etch is reduced to a 2 – 3 microns microetch. This eliminates undercut and produces straight, accurate side walls.
Our manufacturing process starts like other manufacturers. We drill holes in a copper clad laminate, usually starting with 18 microns of copper on the panel.
After the electroplating process there is only a 1-2 microns seed layer of copper to be removed, as compared to the conventional 18 microns base copper layer. As a result there is significantly less etching required to remove the seed layer thus eliminating undercut. This results in the ability to resolve very fine tracks and spaces. It also results in the formation of extremely accurate features such as filters as required on high frequency Printed Circuit Boards.
Plated through holes are stronger and more reliable as a result of the same amount of copper being deposited uniformly in both the holes and on the surface of the PCB. This is most important on PTFE substrates which have large thermal expansion in the “Z” direction.

Our vapor deposition process eliminates common production flaws

Over etching is eliminated with our precise application of copper

We don’t use sodium etching, saving environmental damage

Superior and even copper depositing eliminates barrel cracking

Process Comparison

process1a

LINTEK PROCESS

OTHER MANUFACTURER

process2a

LINTEK PROCESS

OTHER MANUFACTURER

process3a

LINTEK PROCESS

OTHER MANUFACTURER

process4a

LINTEK PROCESS

OTHER MANUFACTURER

process5a

LINTEK PROCESS

OTHER MANUFACTURER

Environmentally responsible

Our method requires fewer process steps and uses less energy than traditional manufacturing methods, making Lintek’s process significantly more environmentally friendly.

Lintek prides it’s self on being an environmentally responsible manufacturer. The vapor deposition process eliminates many chemical process steps used in the manufacture of printed circuit boards. This can include the elimination of:

Palladium Chloride // Formaldehyde // Complexed Coppers //
Reducing Agents // Stannous Chloride // Sodium etch // Tin plating // Tin Stripping

Between 2003 and 2008 the local region was in severe drought and water restrictions were introduced for the community. Although local businesses were not required to reduce water consumption Lintek undertook a project to reduce the plants water consumption by 60%. By installing new equipment and recycling much of the water used, Lintek has succeeded in achieving the 60% reduction.