High Frequency PCB's
Lintek has been manufacturing high frequency PTFE circuit boards since the start of 1990. The printed circuit board industry has always had three major problems when producing Hi frequency PTFE circuit boards.
1. Over-etching
This is caused by the need to etch away 18 microns of copper in the final etching process. The end result of this is many hours wasted tuning critical circuits.
Lintek’s vapor deposition process eliminates this problem having only 1-2 microns of copper to etch away.
2. Sodium Etch
Sodium etch is an environmentally dangerous chemical needed to facilitate the growth of copper on PTFE.
Lintek’s vapor deposition process eliminates the need for Sodium Etch
3. Barrel Cracking
The high “Z” expansion of PTFE substrates can result in barrel cracking of plated through holes.
Lintek’s vapor deposition process deposits an equal amount of copper both in the holes and on the surface of the PCB. This results in a minimum of 35 microns of copper in the barrel of the hole compared to the industry standard of 25 microns.
