Innovative Australian Technology
Lintek's patented High Vacuum Deposition process has been developed and fine tuned over the past 20 years, moving through three generations of metaliser technology. The process is used to vaporise 1-2 microns of copper onto the surface and through the holes of various substrates such as FR4 and PTFE. This is accomplished by using a conveyorised system to pass individual panels into and out of the vapor deposition chamber. Inside the chamber the panels pass over a filament, which is heated to over 2000 °C and is used to vaporises high purity copper wire onto the panel.
The panel is then rotated inside the vapor deposition chamber to enable the second side to be coated. Following this, the panel is returned to the conveyor to move onto the next process step. The Metalisation time for a single 18"x24" panel is approximately 2 minutes.
