Process Capabilities
PTFE: Single Sided, Double Sided and Multilayer with Plated Through Holes including edge plating
FR4: Single Sided, Double Sided and Multilayer (high density surface mount technology)
METAL BACKED PTFE: CNC machined, blind hole plated
MULTILAYER: 4-8 Layers Standard. (Mixed Dielectric Composites available on request)
SUBSTRATES USED
- Standard FR4 Laminates: 0.2 to 3.2mm
- We stock a large variety of PTFE substrates including both thick copper and brass backed PTFE materials (see high frequency substrate link)
DIMENSIONAL CAPABILITIES
- Maximum Double Sided board size: 432mm x 584mm
- Maximum Single Sided board size: 432mm x 1800mm
- Maximum Multilayer board size: 410mm x 560mm
- Smallest PTH hole size: Standard: 0.4mm diameter Special: 0.1mm to 0.35mm diameter
- Track Widths and Spaces: Standard: 0.20mm Special: 0.05mm to 0.15mm
- Best Tolerance on Track an d Space Widths : ±0.008mm depending on design and substrate used
- Plating Thickness: Standard plating thickness is 35 to 50 microns Other thicknesses available on request. Same thickness in holes as on surface
SURFACE FINISH
- Solder Mask and Legend: Liquid, photo imageable over bare copper. Standard colours are Green and White. Blue , Black or Red are available on request. (Peelable solder mask is also available)
- Carbon Screening available
- HASL Solder leveling: Hot air leveled with 0° knives for smoother finish
- Electroplated Nickel
- Electroplated Gold: Both soft and hard Gold available
- Electroplated Silver
- Immersion Gold
- Immersion Silver
MACHINING
- V-Groove
- CNC Routing
- CNC Milling
TESTING
- Electrical bare board testing: Both grid and FPT
QUALITY CERTIFICATIONS
- Quality System AS/NZS ISO 9001:2000
- Underwriters Laboratories (UL) Approval. File number E123884
