Unrivalled Accuracy
After the electroplating process there is only a 1-2 micron seed layer of copper to be removed, as compared to the conventional 18 micron base copper layer. As a result there is significantly less etching required to remove the seed layer thus eliminating undercut. This results in the ability to resolve very fine tracks and spaces. It also results in the formation of extremely accurate features such as filters as required on high frequency Printed circuit boards.
Plated through holes are stronger and more reliable as a result of the same amount of copper being deposited uniformly in both the holes and on the surface of the PCB. This is most important on PTFE substrates which have large thermal expansion in the “Z” direction.
Below is a table showing a comparison between the vapor deposition process and the conventional wet chemistry process.
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